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| MC74VHC1GT14 Schmitt-Trigger Inverter / CMOS Logic Level Shifter LSTTL-Compatible Inputs The MC74VHC1GT14 is a single gate CMOS Schmitt-trigger inverter fabricated with silicon gate CMOS technology. It achieves high speed operation similar to equivalent Bipolar Schottky TTL while maintaining CMOS low power dissipation. The internal circuit is composed of three stages, including a buffer output which provides high noise immunity and stable output. The device input is compatible with TTL-type input thresholds and the output has a full 5 V CMOS level output swing. The input protection circuitry on this device allows overvoltage tolerance on the input, allowing the device to be used as a logic-level translator from 3 V CMOS logic to 5 V CMOS Logic or from 1.8 V CMOS logic to 3 V CMOS Logic while operating at the high-voltage power supply. The MC74VHC1GT14 input structure provides protection when voltages up to 7 V are applied, regardless of the supply voltage. This allows the MC74VHC1GT14 to be used to interface 5 V circuits to 3 V circuits. The output structures also provide protection when VCC = 0 V. These input and output structures help prevent device destruction caused by supply voltage - input/output voltage mismatch, battery backup, hot insertion, etc. The MC74VHC1GT14 can be used to enhance noise immunity or to square up slowly changing waveforms. Features http://onsemi.com MARKING DIAGRAMS 5 SC-88A/SC70-5/SOT-353 DF SUFFIX CASE 419A VC M G G M 1 5 VC M G G 1 5 1 TSOP-5/SOT23-5/SC59-5 DT SUFFIX CASE 483 VC M G * * * * * * * * * High Speed: tPD = 4.5 ns (Typ) at VCC = 5 V Low Power Dissipation: ICC = 1 mA (Max) at TA = 25C TTL-Compatible Inputs: VIL = 0.8 V; VIH = 2 V CMOS-Compatible Outputs: VOH > 0.8 VCC; VOL < 0.1 VCC @Load Power Down Protection Provided on Inputs and Outputs Balanced Propagation Delays Pin and Function Compatible with Other Standard Logic Families Chip Complexity: FETs = 100; Equivalent Gates = 25 Pb-Free Packages are Available 5 = Device Code = Date Code* = Pb-Free Package (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location. PIN ASSIGNMENT 1 2 3 4 5 NC IN A GND OUT Y VCC NC 1 VCC IN A GND 2 3 4 OUT Y FUNCTION TABLE A Input L H Y Output H L Figure 1. Pinout (Top View) ORDERING INFORMATION IN A 1 OUT Y See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. Figure 2. Logic Symbol (c) Semiconductor Components Industries, LLC, 2007 1 February, 2007 - Rev. 12 Publication Order Number: MC74VHC1GT14/D MC74VHC1GT14 MAXIMUM RATINGS Symbol VCC VIN VOUT IIK IOK IOUT ICC PD qJA TL TJ Tstg VESD DC Supply Voltage DC Input Voltage DC Output Voltage Input Diode Current Output Diode Current DC Output Current, per Pin DC Supply Current, VCC and GND Power Dissipation in Still Air Thermal Resistance Lead Temperature, 1 mm from Case for 10 secs Junction Temperature Under Bias Storage Temperature ESD Withstand Voltage Human Body Model (Note 1) Machine Model (Note 2) Charged Device Model (Note 3) Above VCC and Below GND at 125C (Note 4) SC-88A, TSOP-5 SC-88A, TSOP-5 VOUT < GND; VOUT > VCC VCC = 0 High or Low State Characteristics Value -0.5 to +7.0 -0.5 to +7.0 -0.5 to 7.0 -0.5 to VCC + 0.5 -20 +20 +25 +50 200 333 260 +150 -65 to +150 > 2000 > 200 N/A 500 Unit V V V mA mA mA mA mW C/W C C C V ILatchup Latchup Performance mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Tested to EIA/JESD22-A114-A 2. Tested to EIA/JESD22-A115-A 3. Tested to JESD22-C101-A 4. Tested to EIA/JESD78 RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN VOUT TA tr , tf DC Supply Voltage DC Input Voltage DC Output Voltage Operating Temperature Range Input Rise and Fall Time VCC = 3.3 V 0.3 V VCC = 5.0 V 0.5 V VCC = 0 High or Low State Characteristics Min 3.0 0.0 0.0 0.0 -55 - - Max 5.5 5.5 5.5 VCC +125 No Limit No Limit Unit V V V C ns/V Device Junction Temperature versus Time to 0.1% Bond Failures Junction Temperature C 80 90 100 110 120 130 140 Time, Hours 1,032,200 419,300 178,700 79,600 37,000 17,800 8,900 Time, Years 117.8 47.9 20.4 9.4 4.2 2.0 1.0 NORMALIZED FAILURE RATE FAILURE RATE OF PLASTIC = CERAMIC UNTIL INTERMETALLICS OCCUR TJ = 130 C TJ = 100 C TJ = 120 C TJ = 110 C TJ = 80 C 100 TIME, YEARS TJ = 90 C 1 1 10 1000 Figure 3. Failure Rate vs. Time Junction Temperature http://onsemi.com 2 MC74VHC1GT14 DC ELECTRICAL CHARACTERISTICS VCC Symbol VT+ Parameter Positive Threshold Voltage Negative Threshold Voltage Hysteresis Voltage Test Conditions (V) 3.0 4.5 5.5 3.0 4.5 5.5 3.0 4.5 5.5 VIN VT - Min IOH = -50 mA 2.0 3.0 4.5 3.0 4.5 2.0 3.0 4.5 3.0 4.5 0 to 5.5 5.5 5.5 0.0 Min 1.20 1.58 1.79 0.35 0.5 0.6 0.30 0.40 0.50 1.9 2.9 4.4 2.58 3.94 0.0 0.0 0.0 0.1 0.1 0.1 0.36 0.36 0.1 1.0 1.35 0.5 TA = 25C Typ 1.40 1.74 1.94 0.76 1.01 1.13 0.64 0.73 0.81 2.0 3.0 4.5 Max 1.60 2.00 2.10 0.93 1.18 1.29 1.20 1.40 1.60 0.35 0.5 0.6 0.30 0.40 0.50 1.9 2.9 4.4 2.48 3.80 0.1 0.1 0.1 0.44 0.44 1.0 20 1.50 5.0 1.20 1.40 1.60 TA 85C Min Max 1.6 2.0 2.0 0.35 0.5 0.6 0.30 0.40 0.50 1.9 2.9 4.4 2.34 3.66 0.1 0.1 0.1 0.52 0.52 1.0 40 1.65 10 V 1.20 1.40 1.60 -55 TA 125C Min Max 1.6 2.0 2.0 Unit V VT- V VH V VOH Minimum High-Level Output Voltage V V IOH = -4 mA IOH = -8 mA VOL Maximum Low-Level Output Voltage VIN VT + Max IOL = 50 mA IOL = 4 mA IOL = 8 mA IIN ICC ICCT IOPD Maximum Input Leakage Current Maximum Quiescent Supply Current Quiescent Supply Current Output Leakage Current VIN = 5.5 V or GND VIN = VCC or GND Input: VIN = 3.4 V VOUT = 5.5 V V mA mA mA mA II I I I I II I I I I I I II I I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIII I I I II I I I I II I I I I I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I III IIII I I I I II I I I I II I I II IIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I I IIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I I I I I I I I I I I I I I I I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII AC ELECTRICAL CHARACTERISTICS Cload = 50 pF, Input tr/tf = 3.0 ns Min TA = 25C Typ 7.0 8.4 4.5 5.8 5 TA 85C -55 TA 125C Min 1.0 1.0 1.0 1.0 Max Symbol tPLH, tPHL Parameter Test Conditions Max Min 1.0 1.0 1.0 1.0 Max Unit ns Maximum Propagation Delay, A to Y VCC = 3.3 0.3 V VCC = 5.0 0.5 V CL = 15 pF CL = 50 pF CL = 15 pF CL = 50 pF 12.8 16.3 15.0 18.5 10.0 12.0 10 17.0 20.5 8.6 10.6 10 11.5 13.5 10 CIN Maximum Input Capacitance pF Typical @ 25C, VCC = 5.0 V 10 CPD Power Dissipation Capacitance (Note 5) pF 5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no-load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. http://onsemi.com 3 MC74VHC1GT14 A 50% 3.0 V GND tPLH tPHL VOH 50% VCC VOL Y Figure 4. Switching Waveforms TEST POINT OUTPUT DEVICE UNDER TEST CL * *Includes all probe and jig capacitance Figure 5. Test Circuit ORDERING INFORMATION Device MC74VHC1GT14DFT1 M74VHC1GT14DFT1G MC74VHC1GT14DFT2 M74VHC1GT14DFT2G MC74VHC1GT14DTT1 M74VHC1GT14DTT1G Package SC70-5/SC-88A/SOT-353 SC70-5/SC-88A/SOT-353 (Pb-Free) SC70-5/SC-88A/SOT-353 SC70-5/SC-88A/SOT-353 (Pb-Free) SOT23-5/TSOP-5/SC59-5 SOT23-5/TSOP-5/SC59-5 (Pb-Free) 3000/Tape & Reel Shipping For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 4 MC74VHC1GT14 PACKAGE DIMENSIONS SC-88A, SOT-353, SC-70 CASE 419A-02 ISSUE J A G 5 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A-01 OBSOLETE. NEW STANDARD 419A-02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. S 1 2 3 -B- DIM A B C D G H J K N S D 5 PL 0.2 (0.008) M B M N J C INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --- 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --- 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 H K SOLDERING FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 mm inches 1.9 0.0748 SCALE 20:1 *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 MC74VHC1GT14 PACKAGE DIMENSIONS TSOP-5 CASE 483-02 ISSUE G NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. 5. OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION. TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2 FROM BODY. DIM A B C D G H J K L M S MILLIMETERS MIN MAX 3.00 BSC 1.50 BSC 0.90 1.10 0.25 0.50 0.95 BSC 0.01 0.10 0.10 0.26 0.20 0.60 1.25 1.55 0_ 10 _ 2.50 3.00 NOTE 5 2X D 5X 0.20 C A B 5 1 2 4 3 0.10 T 0.20 T L G A B S M K DETAIL Z 2X DETAIL Z J C 0.05 H T SEATING PLANE SOLDERING FOOTPRINT* 1.9 0.074 0.95 0.037 2.4 0.094 1.0 0.039 0.7 0.028 SCALE 10:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative http://onsemi.com 6 MC74VHC1GT14/D |
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